Molybdenum Copper Tab

Molybdenum-copper (Mo-Cu) tabs are composite materials that combine molybdenum's low thermal expansion properties with copper's high thermal conductivity. They are typically manufactured through powder metallurgy or infiltration methods, with adjustable compositions (e.g., Mo85Cu15 to Mo50Cu50) to meet various application needs. Designed to efficiently dissipate heat from electronic devices such as CPUs and power modules, the molybdenum copper tab helps prevent overheating.

Key Advantages
1.High Thermal Conductivity: 165-250 W/m·K, ensuring efficient heat dissipation.

2.Adjustable CTE (Coefficient of Thermal Expansion): 6.8-11.5 × 10⁻⁶/K, matching semiconductors and ceramics to reduce thermal stress.

3.Lightweight: Density of 9.5-10.0 g/cm³, lighter than tungsten-copper, making it ideal for aerospace applications.

4.Excellent Machinability: Can be machined, stamped, and plated, available in net-shaped parts or bulk form, with burr-free edges and high-tolerance processing.

Applications
1.Optoelectronics & Microwave Devices: Used in optoelectronic packaging, microwave enclosures, and laser bases for LEDs and solid-state lasers.

2.RF (Radio Frequency) & Communications: Applied in chip carriers and thermal expansion plates, suitable for 5G mobile network external power amplifiers.

3.Defense Semiconductors: Supports GaAs (Gallium Arsenide) and GaN (Gallium Nitride) semiconductors, used in advanced radar, electronic warfare, and jamming equipment.

4.Aerospace: Due to its lighter weight compared to tungsten-copper, it is ideal for radar cooling systems and missile components.

5.Other High-Power Applications: Used in power transistors and IC thermal management, meeting the demands of high-density electronic circuits.

In recent years, demand for Mo-Cu alloys has surged in electric vehicles (EVs) and 5G communications, particularly in high-power density modules, where its adjustable thermal expansion and superior heat dissipation are crucial for modern electronics. Additionally, its potential applications in optical communication, such as metal carriers combined with ceramics for improved high-frequency transmission, further highlight its growing significance.