Cu/MoCu/Cu Laminate

Copper/Molybdenum-Copper/Copper (CPC) is a layered composite material with copper as the outer layers and a molybdenum-copper alloy core. It offers high thermal conductivity of up to 300 W/m·K and an adjustable coefficient of thermal expansion (CTE) ranging from 7.3 to 11.5 × 10⁻⁶/°C, achieved by varying the copper-to-molybdenum-copper ratio to match semiconductor or ceramic materials. This makes Cu/MoCu/Cu laminate particularly suitable for thermal mounting plates, chip carriers, RF and laser diode packaging, and high-power density modules such as LEDs and communication base station components.

Product Properties

Thermal Conductivity: Up to 300 W/m·K in the in-plane (XY) direction, slightly lower in the through-plane (Z) direction (170-250 W/m·K), exceeding Cu/Mo/Cu materials.

Adjustable CTE: 5.8-11.5 × 10⁻⁶/K, customizable to match semiconductors and ceramics, minimizing thermal stress.

Other Features: Non-magnetic, strong interface bonding, withstands repeated 850°C thermal shocks, and suitable for stamping to reduce costs.

Applications:
1.Thermal Management: Thermal mounting plates, chip carriers for microwave components, LED packaging, and GaAs devices.

2.Electronic Packaging: RF and laser diode packaging, flanges, and frames, ideal for BGA packaging.

3.High-Power Applications: Communication base station server LSI components, semiconductor laser LC and LED components, power modules with low loss and high heat dissipation.

4.Specialized Uses: Vacuum contactors, solid-state seals, sliding friction reinforcement ribs, and high-temperature furnace water-cooled electrode heads.