Molybdenum Copper for Electronic Packaging

Molybdenum copper (MoCu) is high-performance composite materials essential in modern electronic packaging. It combines excellent thermal conductivity, low thermal expansion coefficient, high strength, and good electrical conductivity to meet the demanding requirements of electronic applications.

Electronic packaging plates made from MoCu alloy integrates the high melting point, high strength, low expansion coefficient, corrosion resistance, and mechanical stability of molybdenum with the superior electrical and thermal conductivity of copper. By adjusting the material composition, the thermal expansion coefficient and thermal conductivity can be tailored to meet the specific needs of various electronic packaging applications.

Key Applications in Electronic Packaging
Thermal Management and Chip-Substrate Connection
MoCu electronic packaging plates are primarily used for connecting chips to substrates and dissipating heat. They significantly enhance the thermal efficiency of chips, reduce operating temperatures, and extend their lifespan. Furthermore, their adjustable thermal expansion coefficient allows them to match the thermal expansion characteristics of different materials, minimizing stress concentration and deformation during the packaging process.

Electrical Conductivity
With excellent electrical properties, MoCu electronic packaging plates can serve as conductive components. In high-frequency circuits and microwave devices, they provide stable current transmission paths, ensuring the reliable operation of electronic equipment.

High Thermal Conductivity
MoCu electronic packaging plates typically achieve thermal conductivity levels exceeding 180 W/m·K, far surpassing many traditional heat dissipation materials. This allows them to rapidly transfer heat generated by chips to heat sinks or thermal modules and effectively dissipate it into the surrounding environment, making them an efficient thermal management solution for electronic packaging.

Key Applications in Aerospace and Defense
In aerospace, the high-temperature resistance, high strength, and low thermal expansion of MoCu electronic packaging plates make them invaluable. For instance, they are used in the connections and seals of engines, missiles, and satellites, providing reliable support and ensuring the safety and functionality of critical components.

Molybdenum copper material plays a crucial role in advancing modern electronics, offering unmatched thermal and electrical performance while maintaining mechanical reliability in demanding environments.