Applications in Heat Sinks and Thermal Management

Molybdenum-copper (Mo-Cu) alloy is a high-performance composite material that combines molybdenum's low thermal expansion coefficient (CTE) with copper's high thermal conductivity, making it an ideal solution for heat sinks and thermal management applications in high-power electronic and microwave devices.

Key Advantages
High Thermal Conductivity: Ranges from 165-250 W/m·K, ensuring efficient heat dissipation and preventing thermal accumulation.

Adjustable Thermal Expansion Coefficient (CTE): 6.8-11.5 × 10⁻⁶/K, tunable to match semiconductor and ceramic materials, reducing thermal stress and improving component reliability.

High-Temperature Stability: Maintains mechanical integrity under extreme thermal conditions, suitable for high-power and high-frequency applications.

Lightweight Alternative: Compared to tungsten-copper, Mo-Cu is lighter, making it preferable for aerospace and high-performance electronics.

Excellent Machinability: Supports precision machining, plating, and net-shape manufacturing for customized thermal management solutions.

Applications
Microelectronic Packaging: Heat spreaders and thermal bases for high-power semiconductors, GaAs/GaN devices, and IGBT modules.

RF & Microwave Components: Thermal management in radar systems, satellite communications, and 5G infrastructure.

Laser and Optoelectronic Devices: Heat sinks for high-power lasers, LED modules, and photonic applications.

Aerospace and Defense: Cooling solutions for radar systems, missile guidance electronics, and avionics thermal management.