Molybdenum Copper Used as Microelectronic Material
Molybdenum copper, similar to tungsten copper, has the property of low thermal coefficient. Compared with tungsten thermal coefficient of 4.5x10-6/℃, molybdenum is 5.35 x10-6/℃. Copper owns high heat conductivity. Thus, molybdenum copper has properties of low thermal coefficient and high heat conductivity. The proportion of molybdenum and copper can be adjusted.
Following is a table to show molybdenum copper in different proportion.
|
thermal conductivity |
Thermal coefficient |
Density |
Comparative Thermal |
WCu |
140~210 |
5.6~8.3 |
15~17 |
9~13 |
MoCu |
184~197 |
7.0~7.1 |
9.9~10.0 |
18~20 |
MoCu15 |
160 |
7.0 |
10 |
|
MoCu20 |
170 |
8.0 |
9.9 |
|
MoCu25 |
180 |
9.0 |
9.8 |
|
Mo |
138 |
5.35 |
10.22 |
13.5 |
Cu |
400 |
16.5 |
8.93 |
45 |
Molybdenum copper is widely used in integrated circuit, heat sink and thermal sink or other microelectronic material.
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